AMD EPYC 7313P 16-Core Server CPU 3.0GHz 128MB (Tray)
AMD EPYC 7313P 16-core server processor with 3.0 GHz base clock, 3.7 GHz boost, 128MB L3 cache, 155W TDP. Supports DDR4-3200, PCIe 4.0, 8 memory channels. Tray packaging for OEM deployment.
Available in 6–10 business days : 8 pieces
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The AMD EPYC 7313P is a high-performance 16-core server processor designed for mainstream data center applications. Built on advanced manufacturing technology, this processor delivers exceptional performance and energy efficiency with a base clock of 3.0 GHz and boost speeds up to 3.7 GHz. With 32 threads and a generous 128MB L3 cache, it excels at handling demanding workloads including virtualization, cloud computing, and enterprise applications.
This processor features comprehensive security capabilities including Secure Encrypted Virtualization (SEV), Secure Nested Paging (SEV-SNP), and Secure Memory Encryption (SME) to protect sensitive data. It supports up to 8 memory channels with DDR4-3200 memory, delivering 204.8 GB/s memory bandwidth. The processor includes PCIe 4.0 x128 support for high-speed I/O connectivity and is optimized for single-socket server configurations. With a thermal design power of 155W, it provides excellent power efficiency for data center deployments.
Key Features:
- 16 cores / 32 threads with 3.0 GHz base / 3.7 GHz boost clock
- 128MB L3 cache for improved performance
- DDR4-3200 memory support with 8 channels (up to 512GB)
- PCIe 4.0 x128 for modern I/O connectivity
- 155W TDP for energy-efficient operation
- Advanced security features (SEV, SEV-SNP, SME, Shadow Stack)
- Tray packaging for OEM and system integrator deployment
- SP3 socket compatibility
| Processor Family | AMD EPYC 7003 Series (3rd Gen) |
| Model | EPYC 7313P |
| Cores | 16 |
| Threads | 32 |
| Base Clock | 3.0 GHz |
| Boost Clock | 3.7 GHz |
| Socket | SP3 |
| Socket Count | 1P (Single Socket) |
| L1 Instruction Cache | 16 x 32 KB |
| L1 Data Cache | 16 x 32 KB |
| L2 Cache | 16 x 512 KB |
| L3 Cache | 128 MB |
| TDP | 155 W |
| TDP Up | 180 W |
| Configurable TDP (cTDP) | 155-180 W |
| Manufacturing Process | 7 nm |
| Architecture | Zen 3 (Milan) |
| Memory Type | DDR4 |
| Memory Speed | Up to 3200 MT/s |
| Memory Channels | 8 |
| Maximum Memory | 512 GB |
| Memory Bandwidth | 204.8 GB/s |
| PCIe Version | PCIe 4.0 x128 |
| Integrated Graphics | No |
| Security Features | SEV, SEV-SNP, SME, AMD Shadow Stack, AMD Infinity Guard |
| Supported Technologies | AMD Infinity Guard, AMD Infinity Architecture |
| Workload Affinity | EDA, Media Streaming, CAE, CFD, FEA, Value per Core |
| Launch Date | March 15, 2021 |
| Packaging | Tray |
| Cooler Included | No |
| Overclockable | No |
| Part Number | 100-000000339 |