G-1 Thermal Glue Arctic Cooling - Non-Metallic Thermal Adhesive for RAM/VR Heatsinks
G-1 Thermal Glue by Arctic lowers thermal resistance of RAM/VR heatsinks on CPU/VGA boards for efficient heat dissipation. Non-metallic, prevents short circuits, lasts over 10 years with no aging. Includes mixing wand and container for easy application; residue-free removal.
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The G-1 Thermal Glue from Arctic is specifically designed to reduce the thermal resistance of RAM and VR heatsinks mounted on CPU or VGA boards. This ensures optimal heat dissipation from critical components, improving overall system performance and longevity.
Unlike traditional thermal tapes, G-1 features non-metallic properties that eliminate the risk of short circuits, allowing generous application without worry. It maintains adhesiveness for over 10 years without aging, and comes bundled with a mixing wand and container for precise control over thickness and quantity. After curing, it forms a pad-like structure that’s easy to remove without leaving residue.
- Lowers thermal resistance for better RAM/VR cooling
- Non-conductive to prevent electrical shorts
- Long-lasting adhesion over 10 years
- Includes tools for easy, controlled application
- Residue-free removal post-use
| Type | Thermal Adhesive/Glue |
| Application | RAM/VR Heatsinks on CPU/VGA boards |
| Conductivity | Non-Metallic / Non-Electrically Conductive |
| Adhesion Duration | Over 10 years |
| Included Accessories | Mixing wand and container |
| Removal | Residue-free, pad-like after curing |