Xilence XZ018 Thermal Paste - 5.15 W/m·K, 1.5 g Syringe, -30 to 280°C
High-performance Xilence XZ018 thermal paste with 5.15 W/m·K conductivity, 73 CPS viscosity, and low 0.201 °C/W resistance. Non-conductive, reliable from -30 to 280°C in a convenient 1.5g syringe for easy CPU application.
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The Xilence XZ018 thermal paste delivers exceptional heat transfer with **5.15 W/m·K** conductivity, ensuring efficient cooling and lower CPU temperatures. Its low thermal resistance of 0.201 °C/W and viscosity of 73 CPS make it easy to apply evenly without mess.
Designed for reliability across extreme conditions, it operates continuously from **-30°C to 280°C** and is fully non-electrically conductive, preventing short circuits on high-end components. Ideal for small cases, the compact 1.5g syringe allows precise application even in tight spaces.
- Thermal Conductivity: 5.15 W/m·K
- Viscosity: 73 CPS
- Thermal Resistance: 0.201 °C/W
- Temperature Range: -30 to 280°C
- Net Weight: 1.5 g
- Non-conductive formula
| Thermal conductivity | 5.15 W/m·K |
| Viscosity | 73 CPS |
| Thermal resistance | 0.201 °C/W |
| Operating temperature range | -30 to 280 °C |
| Net weight | 1.5 g |
| Electrically conductive | No |
| Color | Grey |
| Packaging | 1.5 g Syringe |